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A planar power module was developed, and a gate-driver circuit with an over-current protection was planned to integrate into the module. After reviewing several current-sensing methods, the giant-magneto-resistive (GMR) sensor was chosen as a current-sensing method. However, there were several factors that hindered accurate measurement. The high junction temperature of the power dice gave high influence...
A low-temperature silver sintering technology is emerging as a lead-free die-attach solution for high-reliability packaging of power electronics devices and modules. Sintered chips on substrate are reported to have excellent heat dissipation and capability of working at higher junction temperatures. However, one concerning issue with many of the silver sintering die-attach processes is the requirement...
Low-temperature joining technology using nanosilver paste has been widely demonstrated for attaching power chips on silver or gold metallized substrates. In this paper, we investigate the processing conditions of nanosilver paste for bonding large-area chips on a plain copper surface. A double-print, low-pressure-assisted sintering process is developed for attaching the chips on copper. An evaluation...
The low-temperature joining technology (LTJT), either the conventional high-pressure version using micro-size silver powders or the low-pressure version using nanosilver paste, has been widely demonstrated for attaching power chips on silver- or gold-metallized substrates. In this work, we investigated the processing conditions for bonding large-area chips by sintering nanosilver paste directly on...
A nanoscale silver paste that can be sintered at temperatures below 300°C without external pressure is emerging as a promising die-attach material for implementing the low-temperature joining technology in high-temperature packaging. In this paper, we report our findings on silver migration in sintered nanosilver electrode-pair patterns on alumina substrate. The electrode pairs were biased at electric...
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