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We report the design, fabrication and measurement of a dual-band polarization-independent terahertz reflectarray surface integrated on a silicon reflective substrate. The proposed device opens an important avenue for the integration of tunable elements in terahertz reflectarrays.
We demonstrate and review the unique fine-pitch high-aspect ratio tungsten-filled through-silicon vias (W-TSVs) technology developed by Fraunhofer EMFT in high-resitivity silicon substrates. The proposed process flow is fully compatible with both CMOS and MEMS technology, allowing 3D heterogeneous integration of highperformance, low power, compact tunable RF front-ends. We have assessed the figures...
In this work a conceptual design of a conformal antenna array is presented for a millimeter-wave antenna system, optimized for low-cost mass production in PCB technology. The conformal array is constituted by four cube faces with two antennas realized on each face. A printed circuit board (PCB) laminate material was chosen for developing this integrated 60 GHz antenna solution. The beamforming capabilities...
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