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Tuning the electrode impedance through the DC biasing of iridium oxide is presented. Impedance reduction of up to two orders of magnitude was reproducibly observed in 20 μm diameter microelectrodes at a biasing of 1 V.
This paper introduces the first experimental results of a new implantable slim-base three-dimensional (3D) probe array for cerebral applications. The probes are assembled perpendicularly into the slim-base readout platform where electrical and mechanical connections are achieved simultaneously. A new type of micromachined interconnect has been developed to establish electrical connection using extreme...
An out-of-plane interconnect system has been demonstrated. With this type of interconnect approach, different silicon micromachined dies can be electrically and mechanically connected perpendicular to a backbone. The structures are inserted into cavities (which act as sockets) and the electrical contact is established by means of overhanging gold clips. Passive test structures containing daisy chains...
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