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This study compares three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips.
In this paper, influence of temperature gradient in interconnects due to Joule heating in 3D packaging on electromigration failure is presented. Black's Mean Time to Failure (MTF) model relates exponentially to the temperature of interconnects which is assumed to be constant hence does not take into account temperature gradient. The developed electromigration model incorporates the driving force due...
In the current work, numerical evaluation of phase change material along with experimental validation of the same in a handheld device is presented. The value addition and driving force towards the use of phase change material (PCM) is not only due to limited heat dissipation capability and computational sprinting power load patterns in processors but also to have better user experiences of these...
With peak loads in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are excellent candidates for use of phase change materials (PCMs). The experimental and numerical evaluation of such materials used to enhance the performance of a forced convection cooled tablet is presented in this study. The...
Handheld devices with computing capabilities that match laptops and desktops have recently emerged as market drivers in the consumer electronics industry. To accommodate such high performance in small form-factors like that of a tablet is a thermal management challenge. In touch-interactive electronics devices like tablets, skin temperature is as important as the processor temperature. Cooling by...
This study explores the limits of cooling for handheld devices based on both testing and simulation under various conditions and provides guidelines for maximizing the amount of power that can be dissipated in these small form-factor devices. The factors affecting the maximum possible power dissipation are the available surface area and surface finishes, selection of the outer shell materials, thermal...
The objective of the current work is to introduce the concept of boundary-condition-independent (BCI) reduced-order modeling (ROM) for complex electronic packages by the POD-Galerkin methodology. This work focuses on how the Proper Orthogonal Decomposition (POD)-Galerkin methodology can be used with the Finite Volume (FV) method to generate reduced-order models that are boundary-condition-independent...
The objective of the current work is to introduce the concept of boundary-condition-independent (BCI) reduced-order modeling (ROM) for complex electronic packages by employing the proper orthogonal decomposition (POD)-Galerkin methodology. Detailed models of complex electronic packages that consume large computational resources are used within system-level models in computational fluid dynamics (CFD)-based...
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