The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Technical background for CMOS substrate thinning of CEA‐LETI (historically developed for through silicon via technology as well as for more recent activity to provide curved image sensors, for IR as well as for visible spectra) has been applied to realize curved OLED‐based microdisplays. It will be shown that test OLEDs made onto silicon wafers as well as 873 × 500 WVGA, 0.38″ diagonal, and an innovative...
3D technology will be the next step for the development of microelectronic devices. Vertical interconnection is one of the challenging issues. Cu/SiO2 patterned surface might be one of the possible techniques to address it. In this work, direct patterned Cu/SiO2 surfaces bonding at room temperature, atmospheric pressure and ambient air is demonstrated. High alignment and bonding quality is achieved...
In 3D integration circuits, metal bonding is a key stage for stacking wafers. In this contribution, the direct Cu/Cu bonding at atmospheric pressure is investigated. At room temperature, a 2.8 J/m2 bonding toughness is achieved without copper oxide at the interface. The vertical current of this bonding and the possibility to grind the top silicon down to 10 ??m have been demonstrated.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.