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In this study, a dual-side cooling topology based on a silicon cold plate and an electrical functional silicon-interposer with embedded fluid channels is benchmarked against mere back-side cooling. The back-side cold plate can be operated in a split-flow mode, whereas in the case of the interposer only a single in- and outlet can be implemented, which results in a cross-flow heat-exchange mode. An...
The demand of cost reduction and limited installation space for automotive applications requires new and innovative approaches. One approach is to substitute DCB substrates with high current circuit boards. These circuit boards with fully embedded actives like IGBTs and Diodes allows to avoid the use of bonding wires at all and benefit from the less expensive standard circuit board technologies. Moreover...
Current developments and trends in microelectronics are focused on thin layers and novel materials. This leads to application of different test and measurement methods, which are capable to measure basic mechanical properties of such materials on micro-scale and nano-scale. This paper focuses on application of the nanoindentation technique. It is one of the most common method for investigating the...
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