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The paper presents current technological achievements and associated characterizations of the mechanical, thermal and electrical properties of the assembly at wafer level of vertical power devices matrices. Based on direct bonding technology, metallic substrates are bonded to the Silicon active layer at wafer level to ensure back-side common electrode electrical interconnections while offering outstanding...
This study deals with the power electronics packaging and the needs for additional knowledge about electrical pressed contact behavior. For this, a measure bench has been realized. It is able to characterize the pressed interface between a metal electrode and a power chip as a function of the clamping force (0-8000N) and the temperature (up to 100degC). First measurement results show that the electrical...
The paper presents the work that has been carried out trying to improve the behavior and the performances of DC to DC step up converters with high conversion ratio. Especially, it is studied how the design and the realization of the magnetic HF transformer can be improved in order to increase the global efficiency of hard switch isolated DC to DC converters. It is shown that a split in conductors...
The paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and EMI managements. At the same time, the packaging approach is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid integration of the power dies, one on top of the other into a 3D chip on chip...
This paper presents a new approach based on converter networks using elementary cells (ec). It deals with the beginning of research and development carried out on the design of the "ec", the random command and the magnetic coupling among the elementary cells. This paper introduces at first the recent works carried out on interleaved "ec" and power electronics converters (cvs) into...
The purpose of this study concerns the packaging of the vertical power chips used for medium power level modules, from hundreds of W up to several kW. We present a new vision of electrical components packaging that permits to improve the standard switching cell characteristics commonly used in power electronics. We define a generic element that could be the basic element used for the power modules...
Monolithic integration dedicated to power electronics applications simplifies design and implementation of converters. This paper presents a simple and highly integrated gate driver powering technique for AC switches and AC to AC converters. Gate driver supply operating principle and integration are first recalled. Then, it is shown how the proposed solution can easily be implemented into or within...
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