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This study deals with the power electronics packaging and the needs for additional knowledge about electrical pressed contact behavior. For this, a measure bench has been realized. It is able to characterize the pressed interface between a metal electrode and a power chip as a function of the clamping force (0-8000N) and the temperature (up to 100degC). First measurement results show that the electrical...
The paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and EMI managements. At the same time, the packaging approach is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid integration of the power dies, one on top of the other into a 3D chip on chip...
The purpose of this study concerns the packaging of the vertical power chips used for medium power level modules, from hundreds of W up to several kW. We present a new vision of electrical components packaging that permits to improve the standard switching cell characteristics commonly used in power electronics. We define a generic element that could be the basic element used for the power modules...
Interconnection of medium voltage grids associated to the modulation of the transmission line impedance can improves system operation and power quality. However it also leads to rise of the short circuit power. To cope with this constraint and make this new distribution scheme a viable alternative to radial distribution in the future, investigations on short-circuit limitation with a particular line's...
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