The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
This paper first examines the commonly-used thermal-moisture analogy approach in thermal-moisture analogy approach. We conclude that such an analogy using a normalized concentration approach does not exist in the case of soldering reflow, when the solubility of each diffusing material varies with temperature or the saturated moisture concentration is not a constant over an entire range of reflow temperatures...
Nowadays, one of the trends in microelectronic packaging is to integrate multi-functional systems into one package, resulting in more applications of highly dissimilar materials in the form of laminated thin films or composite structures. As a consequence, the number of interfaces increases. Often, the interface between these dissimilar materials is where the failure is most likely to occur especially...
Interfacial delamination is a common cause of failure in microelectronic packages. Characterization and prediction of interface behavior in manufacturing, testing and application conditions is demanded in order to reduce development times and costs of IC packages. In the design processes of microelectronics, possible interface delamination is evaluated by the critical energy release rate to detach...
Nowadays, one of the trends in microelectronic packaging is to integrate multi-functional systems into one package, resulting in more applications of highly dissimilar materials in the form of laminated thin films or composite structures. As a consequence, the number of interfaces increases. Often, the interface between these dissimilar materials is where the failure is most likely to occur especially...
Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability,...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.