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In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness...
The miniaturization of microelectronics has led to the use of polymer dielectric films with a thickness less than a micrometer. The use of polymer dielectric films has introduced new failure modes. To have a better understanding of these failures, knowledge of the mechanical properties is necessary. The through-plane elastic modulus and change in permittivity for a 1 mum thick Cyclotenetrade 4022...
The ongoing miniaturization of microelectronics has led to low-K polymer dielectric films with a thickness of several tens of nanometers. These thin polymer films generally show time dependent material properties, that are different in lateral directions and in-thickness direction. Most techniques available for measuring the mechanical properties of thin films are only capable of obtaining the in-plane...
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