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Signal return path discontinuities, parasitic inductance and impedance mismatch within interconnects are major factors that contribute to degraded high-speed signal quality in three-dimensional (3D) integrated circuits and systems. In this paper, we apply an alternate power delivery method and a novel I/O signaling scheme to a 3D system to address these issues. Two test vehicles made of stacked PCBs...
Advances in 3-D integrated circuit (3-DIC) technology have allowed for advantages in integration, system speed, and power consumption for digital systems. In systems operating at very high data rates with large data width, the effect of simultaneous switching noise (SSN) can, however, drastically affect system performance. Therefore, the effect of SSN in the power delivery network (PDN) design of...
Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.
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