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Recently, three-dimensional integrated circuit (3D IC) integration technology consisting of TSV and micro joints has been viewed as one of the very promising solutions to go beyond Moore's law. Typical solder joints for 3D IC stacking technique under development today has a solder volume about 1000 μm3, which is roughly 1/500 that of a conventional flip-chip solder joint with usually an 100 μm in...
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