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In a fast growing semiconductor market, cost reduction has driven towards package miniaturization with increasing die performance. C90, C65 and C45 wafer technologies with smaller bond pad opening and bond pad pitch have emerged. The requirement of such wafer technologies leaves little or no room for minute die top delamination, as it may result in bond ripped off and electrical failure. To prevent...
For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch >; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
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