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Manufacturing of 3D stacked IC chips has became feasible recently. But testing of these 3D ICs is becoming important in the semiconductor industry. Now a days also embedded core based 3D ICs are equally popular. Hence the increased complexity in the chips becomes a constraint for the test engineers. This paper addresses a 1500-style wrapper optimization in 3D ICs based on Through Silicon Vias(TSVs)...
Summary form only given. System On Chips (SOCs) are being increasingly deployed in large number of applications and systems as they allow automation to be implemented to render ease and convenience in many human activities, a prime example being smart mobile phones. This renders their design implementation a fairly difficult task - with larger product space and product revisions, comes the requirement...
Moore's law has provided a metronome for semiconductor technology over the past four decades. However, when CMOS transistor feature size and interconnect dimensions approach their fundamental limits, aggressive scaling will no longer play a significant role in performance improvement. How should the semiconductor industry provide new value in each generation of products in such a scenario? While Moore's...
We are at the crossroads of some fundamental changes that are taking place in the semiconductor industry. Power is a primary design criterion for bulk of the semiconductor designs now and a key reason behind the shift towards multicore designs as increase in power consumption limits increases in clock speed at the rate we have seen in the past.Voltage is the strongest handle for managing chip power...
Manufacturing and operation-induced variations have emerged as a critical challenge in designing integrated circuits (ICs) under the nanometer technology regime. Most work on addressing variations has focused on device, circuit, and logic-level solutions. As the magnitude of parameter variations increases with technology scaling, these techniques are not sufficient to address the negative impact that...
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