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Increasing demands for higher energy efficiency and operating at harsh environments lead to the development of new compact power electronics, which is complemented by new interconnection technologies. Investigations were made on a planar copper interconnection technology. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects...
Because of the need for electronics use at temperatures beyond 150°C, new high temperature interconnection technologies emerge, like silver sintering and copper wire bonding. In the project PROPOWER inverter modules with IGBTs and diodes mounted on DBC substrates were investigated as a prototype. Analyses were made to study the effects of the new interconnect technologies on fatigue failure. It is...
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