The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
As a consequence of increasing functional density and miniaturization in microelectronics new low-k and ultra-low-k materials are going to be increasingly used in Back-end of line (BEoL) layers of advanced CMOS technologies. These ongoing trends together with the transition to the use of TSVs for 3D-IC-integration cause novel challenges for reliability analysis and prediction of relevant electronics...
Miniaturization and increasing functional integration as the electronic industry drives force the development of feature sizes down to the nanometer range. Moreover, harsh environmental conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ultra low-k materials in back-end of line (BEoL) layers of advanced CMOS technologies, in particular...
The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging solutions for heterogeneous electronic systems. Thermo-mechanical reliability dependent on processing and mounting steps as well as during testing are one major concern, which was addressed by FEA. The numerical...
The electronic industry drive for miniaturization and increasing functional integration forces the development of feature sizes down to the nanometer range. Moreover, harsh environmental conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ultra low-k ILD materials in back-end of line (BEoL) layers of advanced CMOS technologies, in particular...
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology. One way to achieve this is to bury active as well as passive components into the printed circuit boards. In addition, very short interconnects can be realised which is advantageous especially for RF applications. Besides the pure functionality, the designers of new products have to meet...
3D integration is a rapidly growing topic in the semiconductor industry that encompasses different types of technologies. The paper addresses one of the most promising technologies which uses through silicon vias (TSV) for interconnecting stacked devices on wafer-level to perform high density interconnects with a good electrical performance at the smallest form factor for 3D architectures. Fraunhofer...
Design studies of electronic components on the basis of parameterized FE-models and DoE/RSM-approaches are more and more performed to optimize it at early phases of the product development process. That is why electronics components especially in the field of RF, optoelectronics, high temperature and power applications are often exposed to extreme thermal environmental conditions, mechanical shock...
Recent studies show also how the evaluation of mixed mode interface delamination phenomena, classical strength hypotheses along with fracture mechanics approaches and thermal fatigue estimation of solder joints can simultaneously be taken into account. Here such an integrated approach is coupled with optimization algorithms towards a thermo-mechanical reliable design. At the same time, the attention...
Abstract form only given. Lifetime prediction for advanced packaging faces two challenges in the future: lifetime models for the nano-domain (material level) and consistent methodologies for a system approach. Either must incorporate a physics of failure based concept as well as simulative and experimental procedures to analyse failure mechanisms and describe them theoretically on different length...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.