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Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
A comparison study between Sn3.5Ag solder ball and conventional Sn3.8AgO.7Cu (SAC387) solder ball was conducted on 33??33 FCPBGA with SOP pad finishing. After assembly, samples were subjected to laser scanning for slanted ball inspection. Visual inspection under low power scope was done to check for wrinkled balls. Cold ball pull (CBP) was used to evaluate the solder joint strength at 4 conditions,...
A study was conducted to assess the backward compatibility of three different lead-free BGA components using Jedec Solderability testing method (JESD22-B102D). The test was conducted at component level. The three components tested were 29??29 mm Thermally Enhanced PBGA (TePBGA-II) and 35??35mm Tape BGA (TBGA) with SAC387 and Sn3.5Ag solder balls, as well as 33??33 mm Flip Chip HiCTE BGA with only...
Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top...
The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3 um, 4 um, 5 um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The...
As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb- free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabrication of substrates to support Pb-free Semiconductor BGA product packaging. However, the set back...
In this work, Sn3.5Ag solder alloy was being studied for the purpose of Pb-free solder joint reliability improvement over conventional Sn3.8AgO.7Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level, Sn3.5Ag showed no intermetallic brittle failure in cold ball pull test even up to 6times multiple...
Solder joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the under-bump metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au...
The purpose of this study is to discuss on the effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method. Three samples of different lead free solder joint material were choosed in this experiment that are Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni 0.01Co (SANC), and Sn3.5Ag. Then the lead free solder joint material samples were subjected...
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