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In this study, a wafer level chip scaled packaging (WLCSP) having the capability of redistributing the electrical circuit is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. In the fan-out WLCSP, the solder bumps could be located on both the filler polymer and chip surface. The concept of the fan-out WLCSP and the processes of fabricating the novel fan-out...
A novel chip-on-metal structure of the advanced wafer level chip scale package (WLCSP) which has the capability of redistributing the electrical circuit is proposed in this study. In the WLCSP, the solder on rubber (SOR) design expands the chip area and also provides a buffer layer for the deformation energy from the coefficient of thermal expansion (CTE) mismatch. By using the solder ball shear test,...
Microscopic examination of microbiotic soil crust shows that the profiles of soil with a dense cyanobacterial cover had two different layers: a surface thin layer composed of aeolian-born materials and an organic layer formed by filamentous cyanobacteria associated with sand particles. The results indicate that microbiotic cover is an important determinant of sand fixation in the Gurbantunggut Desert,...
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