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There are dozens of double‐site and triple‐site dopant–defect complexes in Mg–H‐codoped GaN that can compensate the MgGa acceptor and thus limit p‐type conductivity; however, their properties have not been systematically studied. Using first‐principles calculations, herein, it is found that the well‐known double‐site complexes MgGa–VN and MgGa–HN can still act as donors, although they are already...
This paper proposes an Active Gate Current Control (AGCC) strategy for non-insulating gate WBG devices, for example, gallium nitride gate-injection-transistor (GaN-GIT) and silicon carbide super junction transistor (SiC-SJT). It provides a tool for power converter designers to further improve the converter efficiency and to extend the life time of those higher cost power transistors. By continuously...
The emerging 650 V large current rating, Enhancement-mode (E-mode) Gallium Nitride High-Electron-Mobility Transistor (GaN HEMT) is a promising device for low to medium power, high power density converters (e.g., motor drives, battery chargers), which require high robustness levels. Thus, a comprehensive study of the short circuit behavior of high power E-mode GaN HEMT is the subject of this paper...
With the rapid development of the wide bandgap (WBG) power transistor technology, the latest Silicon-Carbide and Gallium-Nitride (SiC and GaN) based power transistors can be used as the main switches in the medium power (≥10 kW) conversion systems. Electrical signal based efficiency measurement could be very challenging due to the high-frequency output signals and the high power to loss ratio. In...
This paper presents an evaluation of a newly released power stage direct drive GaN HEMT. The double pulse test is performed and the dynamic performance is characterized. PCB layout optimization is also investigated for improved switching transients. It is shown that the direct drive system provides simplified circuit design, reduced number of external components, and small gate loop parasitics. Also,...
Wide bandgap material based power electronics devices including Silicon Carbide MOSFETs, JFETs, and Gallium Nitride HEMTs are poised to change the landscape of the power electronics industry with their superior high temperature capability, low switching loss and low conduction loss. This paper first provides an overview of the development of WBG devices and their applications, then focuses on how...
This paper presents a comparison study of three isolated DC/DC circuit topologies, LLC resonant circuit, phase shift bridge circuit and phase shift quasi switched capacitor (QSC) circuit. The device stress of three circuits is compared using total switching device power (SDP) which can be used as an indicator of circuit efficiency, device cooling requirement, device packaging requirement and cost...
With the rapid development of wide bandgap power transistor technology, the latest gallium-nitride based power transistors are able to be used as the main switches in the high power (≥10 kW) conversion systems. In order to achieve the desired high efficiency and higher power density successfully, the entire GaN based power conversion system needs to take multiple considerations into the design stage...
Gallium Nitride (GaN) power devices become commercially available in recent years and they have demonstrated great potential in DC power supply applications. In this paper, the device loss of three GaN device based isolated DC/DC circuits, LLC circuit, dual active bridge (DAB) circuit and phase shift quasi switched capacitor (QSC) circuit, is investigated and compared using telecom power supply application...
The medium power rating two-level three phase voltage source inverter is among the most popular power conversion systems. The typical switching frequency of the commercial medium power rating inverter, however, is limited to tens of kHz. By increasing the switching frequency and using emerging gallium-nitride devices, the size of the overall system can be greatly reduced. This paper begins by reviewing...
Paralleling devices is an effective way to achieve higher power applications while still having the convenience brought by discrete devices. However, very few papers investigate the challenges of paralleling Gallium Nitride high electron mobility transistors (GaN HEMTs) in cascode configuration, especially the potential failure modes and its related mechanisms. In this paper, a comprehensive study...
In this paper, we present a comprehensive evaluation of the latest 600 V class Gallium Nitride based Gate Injection Transistor (GaN-GIT) for high temperature and high efficiency applications. In this study, the Panasonic GITs are used as the reference for latest GaN-GIT technology. Static and dynamic testing was performed on the two GaN-GIT versions to extract critical static parameters and switching...
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