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Processing of bump-less or embedded microbumps is introduced in this paper as an approach which enables scaling microbumps for below 10um pitches. Landing wafer is standard damascene process and in top wafer bumps are embedded in a soft backed polymer. Later during thermo-compression bonding this polymer is cured to bond two chips together. Process flow and results of TC bonding is discussed in this...
A feasibility study of die-to-wafer (D2W) bonding of inorganic dielectric layers is conducted on common industrial tools in a typical cleanroom environment. With the help of an additional cleaning step after dicing of the top wafers or using stealth dicing process, 100% bonding success rate from wafers with chemical mechanical polished (CMP-ed) SiO2 has been achieved. Plasma treatment of the top dies...
Room temperature and pressure bonding is shown for wafer-to-wafer (W2W) bonding but never for small chips. Usually, thermo-compression bonding (TCB) is employed for die-to-die (D2D) and die-to-wafer (D2W) bonding for 3D and MEMS application. TCB process is itself limited by tool capability and requires pressure and temperature for bonding which is not only time consuming but can induce coefficient...
3-D stacking with vertical interconnection of thinned microelectronic silicon chips is a novel approach to achieve the enhanced performance, higher density, and smaller size of integrated circuits with a better multifunctionality than the traditional 2-D chip packaging. To achieve this, high alignment accuracy is required between the top chip and the bottom substrate along with good bonding between...
In this paper a bump-less process is introduced in order to further scale down the pitch of microbumps. Electrical resistance measurement, Cross section SEM and mechanical characterizations show successful 3D stacking using proposed method.
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