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This study proposes a new concept for improvement of transmission characteristics at Gbps region even in wire length longer than 100 m. Our idea is characterized by adding evanescent energy to the common propagating signal energy along a metal wire. The evanescent wave constantly emits and scatters electromagnetic energy to air field due to not a little attenuated signal energy. Reuse of the evanescent...
Presented in this paper is a new chip stacking technology for very high bandwidth communication. This technology utilizes transmission line coupling between two differential pairs in the metal layers of the stacked LSI chips. We have demonstrated communication at 12.5 GHz between two differential pairs of transmission lines fabricated on different metal layers in a single chip. This technology is...
In this paper, we introduce a very high bandwidth proximity communication technique for Stacked LSIs. This technology is based on transmission line coupling between two differential pairs in the metal layers of each chip and can be implemented without modifying conventional chip fabrication process. We have demonstrated its feasibility using a single chip in which coupled two differential pairs of...
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