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This paper proposes a novel DC-excited flux-modulated linear machine with new primary structure for utilizing amorphous core. Although amorphous core is regarded as a good candidate in high efficient electric machine, and being investigated for decades, it has not been widely used in electric machines yet. The key problem is the difficulty in slotting. For the new structure, the difficulty in slotting...
The purpose of this study is to evaluate the strength of TSV silicon chips using a point-load on elastic foundation (PoEF) test, associated with an acoustic emission (AE) method for detecting local material cracks or delamination occurring during the test before the chip breaking (or catastrophic failure). The results indicate that there are no larger-than-25 dB AE signals and no via cracks occurring...
Cylindrical active coated nano-particles comprised of a silica nano-cylinder core covered with a plasmonic nano-shell are investigated with regard to their near- and far-field properties. The source of excitation is taken to be an electric or a magnetic line current, while three different plasmonic materials are employed for the nano-shells, namely silver, gold and copper.
A new CMOS LC voltage-controlled oscillator (VCO) circuit design using multiwalled carbon nanotube (MWCNT) wire inductor in LC tank circuit is presented. The VCO is designed in TSMC 0.18 μm CMOS process. We have applied our recently reported one-dimensional fluid electronic transport model of multiwalled carbon nanotube interconnect in π-model of the inductor. We have studied...
This paper investigates several issues in finite element modeling of electromigration in solder joints: current density and thermal stress singularities; negative divergences of atomic fluxes due to electron current and thermal stresses; and submodeling accuracy. A copper post wafer level package is used as a test vehicle for simulation. Coupled electrical-, thermal-, and mechanical finite element...
Through-silicon-via (TSV) technology has been demonstrated to be capable of being applied into many microelectronics products, e.g., CMOS image sensor (CIS), DRAM, flash memory, 3D-MEMS, RF-SiP, logic-SiP, LED, etc. However, new IC design is needed to implement the TSV interconnect into a chip and the specific TSV line is required for TSV fabrication, the facts of long time needed for new IC design...
The winding copper loss can be significantly increased due to skin and proximity eddy current effects. The skin and proximity losses due to fundamental frequency current has been investigated in literature, but the influence of PWM on the skin and proximity losses has not been reported. In this paper, 2-D finite element method is employed to analyze the skin and proximity losses in a permanent magnet...
The proliferation of wireless and mobile devices has fostered the demand of context aware applications. Location is one of the most significant contexts. Multilateration, as a basic building block of localization, however, have not yet overcome the challenges of (1) poor ranging measurement; (2) dynamic and noisy environments; (3) fluctuations in wireless communications. Hence, they often suffer poor...
The sporadic voiding phenomenon in Cu3Sn intermetallic compound (IMC) formed during thermal aging, sometimes referred to as "Kirkendall voiding", has been found to lead to degradation of solder joint reliability in board level shock testing. It was suggested that the voiding phenomenon resulted from the incorporation of specific impurities in the copper during electroplating. In this study,...
In this study, spin-transfer induced magnetization dynamics in exchange-biased spin-valves, for both polarities of current and field are studied. The structure of the samples included a synthetic pinned layer and a soft free layer, patterned into square pillars with a lateral size of the order of 100 nm. The resistance of the pillars was of the order of 5Omega, and the measured giant magnetoresistance...
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