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Compared with the traditional flow for IC designs, the assignment of inter-die signals is an important stage in a die-stacking SiP design. In this paper, firstly, a connection graph for all the pads in a boundary stack can be constructed and a set of dynamic tracks can be defined from the corresponding connection graph. Based on the definition of the dynamic tracks in a connection graph, a modified...
Resistive-switching behaviors in transition metal oxides, such as NiO and TiO2, have attracted great attention recently due to the potential for the next-generation nonvolatile memory applications. However, read disturbance due to the cross-talk among neighboring cells is a serious issue for the implementation of large memory array. Traditionally, a transistor can be added as a selection element in...
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