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A 3D IC heterogeneous chip integration of 65nm RF receiver, 28nm baseband processor, and 40nm DRAM on a proprietary CoWoS structure is demonstrated and its electrical characterization of KGS (Known Good Stack) has revealed a highly comparable system performance as compared to that of the KGD (Known Good Die) testing data. Moreover, an innovative system BIST (Built-in-Self-Test) scheme and methodology...
A 3D IC heterogeneous chip integration of 65nm RF receiver, 28nm baseband processor, and 40nm DRAM on a proprietary CoWoS structure is demonstrated and its electrical characterization of KGS (Known Good Stack) has revealed a highly comparable system performance as compared to that of the KGD (Known Good Die) testing data. Moreover, an innovative system BIST (Built-in-Self-Test) scheme and methodology...
The macroscopic response of an incompressible power-law matrix containing aligned spheroidal voids is investigated. The voids are assumed to be arranged in a uniform array, and the response of the solid is evaluated by isolating a typical block of the material containing a single void. The requisite boundary value problem for this unit cell is solved using a spectral method which is an adaption...
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