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Hybrid pixel detectors are now widely used in particle physics experiments and at synchrotron light sources. They have also stimulated growing interest in other fields and, in particular, in medical imaging. Through the continuous pursuit of miniaturization in CMOS it has been possible to increase the functionality per pixel while maintaining or even shrinking pixel dimensions. The main constraint...
This paper presents the prototype of a 3D circuit in which a Wafer Level Packaged CMOS image sensor is vertically assembled with an image signal processor in a face-to-back integration scheme. The design flow used to hybrydize the two circuits will be fully described, up to physical implementation. The process technology carried out will be presented in a 200 mm environment. Finally, the 3D assembly...
System integration, performance, cost and enhanced product functionality form the major driving forces behind contemporary innovations in packaging. The need for miniaturization has led to new architectures which combine a whole range of different technologies. The ultimate miniaturization goal is to incorporate all of the elements necessary to build the system in the same package. This approach of...
Through Silicon Via (TSV) is a very attractive solution for 3D stacking. One of the main concerns regarding the TSV technologies is the resulting stress build up inside the silicon substrate that induces warpage or expansion at the wafer level, crystalline defects in the neighboring silicon of the TSV and finally can impact performances and reliability of CMOS device as well. In this work, we show...
3D integration development has to be driven by industrial demand and applications. To get interested in those technological developments, industrials shall be convinced by benefits of Through Silicon Vias (TSV) integration versus traditional assembly approach. This will demonstrate that this approach is worth being more developed and implemented. In this study, we demonstrated that we are able to...
This paper deals with the development of a process for medium density through silicon via (TSV) polymer filling. This solution is driven by reliability considerations. Firstly, a set of specifications concerning the polymer selection is presented. Secondly, the process optimization with two kinds of polymers is presented: a liquid resin and a dry film resist. Issues with both of the solutions are...
As 3D packaging technologies are becoming more and more present in packaging roadmap, applications with higher requirement are rising continuously. Today, one of the main applications requiring 3D technologies is dedicated to nomadic components, including mobile phones, due to their very high compacity and integration capabilities. Those components need to work at high frequency, typically up to 1...
Through Silicon Via (TSV) is a one of the more important bricks for 3D stacking and offer different integration approaches. The via-last approach has been first introduced into production. Yet the via-first approach is also currently actively investigated since it has some advantages particularly the use of high conformal deposition materials for isolation and filling of the TSVs enabling higher density...
Today, a new trend in wafer level packaging is to add more than one die in the same package and, sometimes, to use the third dimension in order to: Decrease the form factor of the final system; Improve the thermal and electrical performances of the device; Decrease the cost of the final product. In order to stack the heterogeneous components in the third dimension, TSV (through silicon vias) is a...
In this paper, the technological bricks specifically developed for 3D integration of a set top box demonstrator will be presented. The integration flow was based on the 45 nm technology top chip stacked on a 130 nm technology active bottom wafer. This flow needed to develop specific wafer level packaging technologies such as: (1) Top chip & bottom chip interconnections (2) High aspect ratio TSV...
The challenges of 3-D integration are its sophisticated processes that require deposition, etching, bumping, plating, thinning, etc., which drive the need for wafer bonding materials that can sustain the high temperatures and chemically stringent environments found in these processes. This paper presents the development of a novel polymer material to be used as a wafer bonding material suitable for...
Three-dimensional (3-D) wafer stacking technologies offer new possibilities in terms of device architecture and miniaturization. To stack wafers, reliable through-silicon vias (TSVs) and interconnections must be processed into ultrathin wafers, and such processing is made possible by new methods for wafer handling. Of the different wafer-level bonding techniques, temporary wafer bonding adhesives...
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