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A process development for stretchable silicon electronics encapsulated in a layer of polydimethylsiloxane is presented. Stretchability is achieved by segmenting the normally rigid silicon substrate into small islands (<2??2 mm2) and connecting these by flexible metal interconnects. The metal interconnects have a mesh shape providing stretchability and improved reliability. The mesh-shaped interconnects...
The possibility to conform microelectronic circuits onto non-planar or even high-curvature surfaces is of increasing interest for future applications. A promising flexible substrate concept based on vertical thinning/lateral partitioning and the substrate transfer technology is developed. Test structures for flexibility testing which consist of a partitioned ultra-thin poly-silicon layer sandwiched...
In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness...
In this paper, results of experiments and FE simulations on mechanical issues of poly-and single crystalline silicon on ultra-thin polyimide substrates are presented. Formation and propagation of cracks within the silicon and dielectric layers are then studied under controlled bending and tensile tests using bending and tensile tools being custom designed for this purpose. The results show that the...
The acceptable flexibility and stretchability for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide/silica rubber and patterning the poly-silicon or silicon into square/hexagon segmentations. The segments interconnect by metal wires for the signal communication, different wire shapes are designed to reach more flexible. In this contribution, results...
The acceptable flexibility for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide and patterning the poly-silicon or silicon into square/hexagon segmentations. The segments interconnect by metal wires for the signal communication, different wire shapes are designed to reach more flexible. In this contribution, results of FE optimization on mechanical...
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