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High end networking and computing applications continue to drive silicon technologies for higher data rates and increased bandwidth. The push for silicon performance also drives a need for packaging performance to deliver clean and efficient power to the device. This paper compares the electrical performance of three new advanced packaging technologies designed to improve the DC and AC power delivery...
Since its introduction in the early 1990s, plastic ball grid array (PBGA) package had become the ldquopackage of choicerdquo due to its good electrical performance, lower cost, high assembly yield and self-alignment during board assembly process. Thermo-mechanical behavior of PBGA is highly dependent on the properties of the constituent components. The relative mechanical compliances and thermal expansion...
High end computing and networking applications continue to drive silicon technologies for higher performance, increased bandwidth and frequency. The drive for higher performance has resulted in increased power dissipation. A method for mitigating power dissipation includes reducing the voltage but unfortunately the consequence is reduced noise margin. This paper evaluates the electrical performance...
Power and power density increase in microelectronics is a major challenge for packaging high performance ASIC and microprocessor devices. The thermal interface material (TIM) used between the chip and the heat spreader of the Flip Chip Plastic Ball Grid Array (FC-PBGA) package plays a very important role in the package thermal performance. Not only does it affect package thermal performance, it can...
Manufacturability and reliability of a custom CSP SRAM mounted on an interposer is discussed in this paper. In order to provide a reliable device for high reliability applications, an SRAM interposer structure was designed to ensure high reliability on every level of solder joint interconnects. Finite element modeling method was used as a mean to evaluate the reliability of various configurations...
Reliability of the flip-chip plastic ball grid array (FC-PBGA) packages is highly dependent on the properties of the constituent components and the interface formed between them. The relative mechanical compliances and thermal mismatch between the silicon chip, the underfill material and the organic laminate substrate are particularly important to the design and performance the package. Strong coupling...
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