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The effect of the variation of processing parameters such as thermal history, or the composition of Sn-Ag-Cu solder joints, on microstructure and reliability performance depends strongly on joint geometry, in particular length scale. The advent of 2.5/3D packaging technologies in microelectronics has further decreased joint length scales and changed interconnect aspect ratios to reduce I/O pitch....
With the challenges of moving to 2.5/3D packaging structures, it has become imperative to improve our understanding of the materials science of fine pitch Pb-free solder joints. The use of Cu pillars capped with thin layers of SnAg solder provides for tighter bump pitches reducing the chance of solder bridging at chip joining. However, changes in geometry, materials and processes associated with 2...
The effects of changes in thermal history (changes in the reflow profile) on solder joint microstructure are examined. The effects of variations in the reflow temperature, and in the cooling rate from the melt, on the microstructure of near eutectic lead free SnAgCu solder joints were investigated. Changes in precipitate or Sn grain morphologies have previously been correlated with changes in the...
Digital image correlation and cross polarizer, optical microscopy were used to quantify the deformation behavior under deep thermal cycling of near eutectic SnAgCu (SAC) solder in board level interconnects. Maps with sub micron spatial resolution of the strain levels and von Mises strain were produced for selected cross sections. Large spatial variations in the thermo mechanical response of the solder...
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