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ePIXfab brings silicon photonics within reach of European small and medium sized enterprises, thereby building on its track record and its integration into Europractice. To this end, ePIXfab offers affordable access to standardized active and passive silicon photonic IC and packaging technology, a path from design to manufacturing and hands-on training. Based on a consortium of major research institutes...
This work presents an opto-mechanical linear actuator utilizing the gradient optical force between two identical parallel waveguides. The actuator size shrinks to nanoscale dimensions. Theoretical study shows that the actuator deflection is controlled over optical signals and linearly proportional to the applied optical power. Such optical actuator takes full advantages of the nanotechnology, and...
High-speed (121/25 ps rise/fall time) and low-switching energy (7.1 and 3.4 fJ) all-optical flip-flop operation of single-wavelength high-mesa asymmetric active-MMI bi-stable laser diodes is demonstrated for the first time using 25 ps long switching pulses.
Optical switches are important for applications in optical communications and photonic integrated circuits (PICs) to allow for selection of optical paths. In this work, a thermo-optic switch based on a Mach-Zehnder interferometer (MZI) is designed. A comparison and optimization of the switch components, including beam splitters, couplers and MZI, is carried out. A 1 × 2 switch using silicon nitride...
We propose chip-based Tbaud processing for all-optical performance monitoring, switching and demultiplexing. We demonstrate the first transmitter optimization and receiver-end demultiplexing of 1.28 Tbit/s OOK signals. Both exploited Kerr nonlinearity in dispersion-engineered As2S3 planar waveguide.
Over the past 30 years, IBM has provided leadership in high density I/O density and count interconnects at both chip and package levels as has been necessary for processor chips in high end symmetrical multiple processor (SMP) servers. For example, IBM introduced multi-chip modules (MCMs) in the 1970's, thermal conduction modules (TCMs) in the 1980's, and advanced organic micro-via buildup-layer packages...
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