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New Findings
What is the central question of the study?
Cuff‐occlusion duration may influence contrast‐enhanced ultrasound (CEUS) assessments of skeletal muscle microvascular blood flow responsiveness: what are the effects of 1, 3 and 5 min cuff‐occlusion on the magnitude and reliability of calf muscle microvascular blood flow responsiveness in older adults?
What is the main finding and its importance?...
Wafer Level Packaging (WLP) is a packaging technology focusing on integrated circuit (IC) packaging at wafer level instead of die level. WLP essentially consists of IC foundry fabrication process and subsequent device interconnection and back-end passivation process. The general wafer level packages (WLPs) are designed for fan-in chip scale packaging but the shrinkage of pad pitch and size at the...
The traditional wafer level packages (WLPs) are fan-in redistribution layer (RDL) lay-out design; it may not be able to meet the high pin-count handheld device requirement. So the new fan-out wafer level packages (FOWLPs) are emerged in the last few years. The fan-out WLP starts with the reconfiguration dies on carrier and embeds die by molded compound. The molded reconstituted wafer forms a compound...
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