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The paper presents a low temperature (with 60 °C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully...
In the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical...
In this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 $\mu \text{m}$ and resistivities of $\sim 9.8~\mu \Omega \cdot {\rm cm}$ on a flexible polyimide substrate via thermal sintering at 300 °C for 30 min. In addition, a printed interdigitated capacitor with an electrode...
Inkjet printing has been one of fascinating techniques for microfabrication owing to the characteristics of low manufacturing cost, low processing temperature, low material usage,…etc. [1, 2]. In this work, a Lift-off Printing (LoP) process combining conventional photolithography and inkjet printing processes is introduced to realize printed size-scalable silver microstructures with the line width...
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