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Thermal issue becomes a key challenge in 3-D integrated circuits (3-D ICs) due to their highly integrated and compact design. To give a fast and accurate prediction of the transient temperature field, a new unconditional stable scheme for heat conduction equation is proposed in this paper. This method, thermal-weighted Laguerre polynomials (WLP), uses WLPs as basis functions and Galerkin’s method...
Pneumatic diaphragm drop-on-demand (DOD) Technology is an attractive method for Sn conductive lines owing to low-cost, low-waste, and simple process. Based on stable generation of Sn droplets, the process parameters such as droplet spacing and deposition height have significant effect on the final quality of Sn conductive lines. In this work, Sn conductive lines were generated while droplet spacing...
The well-controlled droplets jetting forming permits high efficiency in bonding wire manufacture. In order to achieve better control of the droplets jetting forming, numerous parameters in the jetting process should be studied. This article study the effect of substrate temperature on the solidification of tin bonding wire. Experiments on the solidification of tin bonding wire under different substrate...
Quantum dots (QDs) have been developed as a promising light-converting material for light-emitting diodes (LEDs). However, QDs-polymer film always shows bad thermal performance. In this paper, a new designed structure of QDs-polymer film via electrospinning was proposed to enhance the thermal conductivity of the QDs-polymer film. After the measurement of density, specific heat and thermal diffusivity,...
A finite element model for evaluating the performance of the MEMS air flow sensor with sapphire as substrate was established. The temperature distribution of the MEMS sensor chip with respect to different air flow was calculated by COMSOL Multiphysics. The trenches etched in the substrate were used to reduce the heat transfer from the heater to the temperature measuring thermistors within the substrate...
As a uniform solder balls manufacturing technology, metal droplets jetting technology can realize controllable deposition of droplets, so it can apply to the production of solder balls array in BGA and CSP packaging. To study the influence parameters to the morphology of the solder balls, we developed an equipment based on the Pneumatic diaphragm drop-on-demand Technology. In this paper, we changed...
The aim of this paper is to study the heat dissipation enhancement effect of LED filament bulb by using ionic wind. A LED filament bulb with 6 filaments is used for studying. There are two holes drilled at the end of the bulb and the ionic wind blows into the inner space of the bulb through the holes that will strengthen the heat convection of the filaments. The ionic wind generator includes the needle-net...
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
In this paper, simulation model for the response time of micro flow sensor using COMSOL Multiphysics is presented. The detailed structure of the micro flow sensor chip is considered in the simulation model. What's more, the temperature dependencies of physical properties of air are defined to improve the model precision. The model takes into consideration the transient conduction and convection between...
The effective thermal conductivity (ETC) of silicone matrix embedded with particulate phosphors is of great importance in the thermal management of white light-emitting diode (LED) packages, not only because the mixture provides the heat dissipation path but also because the phosphors may generate heat as well. In this paper, a 2D/3D unit cell method with considering interface resistance was proposed...
The paper presents an analysis of self-heating effect on micro-machined temperature difference air flow sensor, and demonstrates through modeling and simulation that self-heating effect can influence the output of the air flow sensor. The mathematical model of the sensor based on an existing microsensor chip is set up, and some details of the chip structure are considered in the model. The sensor's...
In this paper, simulation and optimization of a micro flow sensor is presented. Modeling of the micro flow sensor using ANSYS Fluent for temperature distribution is studied. The detailed structure of the micro flow sensor chip is considered in the simulation model. What's more, the temperature dependencies of physical properties of air are defined to improve the model precision. As a key parameter,...
The effective thermal conductivity (ETC) of silicone matrix embedded with particulate phosphors is of great importance in the thermal management of white light-emitting diode (LED) packages, not only because the mixture provides the heat dissipation path but also because the phosphors may generate heat as well. In this paper, a 2D/3D unit cell method with considering interface resistance was proposed...
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
The paper presents an analysis of self-heating effect on micro-machined temperature difference air flow sensor, and demonstrates through modeling and simulation that self-heating effect can influence the output of the air flow sensor. The mathematical model of the sensor based on an existing microsensor chip is set up, and some details of the chip structure are considered in the model. The sensor's...
In this paper, simulation model for the response time of micro flow sensor using COMSOL Multiphysics is presented. The detailed structure of the micro flow sensor chip is considered in the simulation model. What's more, the temperature dependencies of physical properties of air are defined to improve the model precision. The model takes into consideration the transient conduction and convection between...
Quadrate Flat Package (QFP) is chosen as package mode of chip for typical Hall-effect current sensors. In this paper, taking the deformation behavior of QFD structure under the temperature loading into consideration, according to related physics laws such as Fourier heat transfer law, Stephen-Boltzmann law and Newton's law of cooling, the thermal simulation of packaging for current sensor is implemented...
The thermal conductivity of finite-length singlewalled carbon nanotubes (SWCNTs) was investigated using non-equilibrium molecular dynamics (NEMD) simulations. The temperature and diameter dependence of thermal conductivity was studied in this paper. In this work, thermal conductivity of SWCNTs with the length of 24.5nm and different diameter — (6, 6), (7, 7), (8, 8), (10, 10), (15, 15) was studied...
Thick-film pressure sensors on steel substrate are proven to be robust and low cost, and can be used in many fields such as automotive industries, oil industries and military sectors. In this paper, finite element method (FEM) was used to evaluate residual thermal stresses and the self-heating of the thick film resistors (TFRs) on the offset voltage of the sensor. Results show that the residual stresses...
Now, many specialists and scholars have used atomistic models and continuum models to investigate mechanical behaviors of carbon nanotube about axially compressed buckling.But the studies on axially compressed buckling were mostly theoretic analysis. This work focused on compressive buckling of carbon nanotube plated with nickel in axial movement. In this work, when carbon nanotubes (CNTs) were coated...
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