The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Two embedded micro-wafer-level packages (EMWLP) with 1) laterally placed and 2) vertically stacked thin dies are designed and developed. Three-dimensional stacking of thin dies is demonstrated as progressive miniaturization driver for multi-chip EMWLP. Both the developed packages have dimensions of 10 mm × 10 mm × 0.4 mm and solder ball pitch of 0.4 mm. As part of the development several key processes...
Die shift problem that arises during the wafer molding process in embedded micro wafer level package fabrication was systematically analyzed and solution strategies were developed. A methodology to measure die shift was developed and applied to create maps of die shift on an 8 inch wafer. A total of 256 dies were embedded in an 8 inch mold compound wafer using compression molding. Thermal and cure...
This paper presents the evaluation results of low temperature cure dielectrics in terms of process ability, adhesion to Si, SiN, Cu RDL and mold compound substrates. Minimum via opening of 10 μm without residue was achieved for 5 μm dielectric film thickness. Adhesion tests results were conducted based on JEDEC standards for MSL1 and unbiased HAST testing and they demonstrated that the low temperature...
Main objective of this study is to design and development of multi-die embedded micro wafer level packages (EMWLP) reliability test vehicles. Such as, the laterally placed die EMWLP and the vertically stacked thin die EMWLP. For reliability evaluation, EMWLPs have been subjected to both environmental and mechanical reliability tests as per JEDEC standards. These reliability tests include highly accelerated...
In the embedded wafer-level packaging field, the embedded micro wafer level package (EMWLP) technology leverages on fan-out redistribution connections, keeping the reliance on wire-bonding and flip-chip bump connections to a minimum, thus streamlining the packaging process. As the embedded micro wafer level packaging (EMWLP) technology evolves to capitalize on package-on-package (POP) technology,...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.