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Purpose
To introduce a novel convolutional neural network (CNN)‐based approach for frequency‐and‐phase correction (FPC) of MR spectroscopy (MRS) spectra to achieve fast and accurate FPC of single‐voxel MEGA‐PRESS MRS data.
Methods
Two neural networks (one for frequency and one for phase) were trained and validated using published simulated and in vivo MEGA‐PRESS MRS dataset with wide‐range artificial...
Purpose Cumulative evidence supports the clear relationship of obstructive sleep apnea (OSA) with cardiovascular disease (CVD). And, adherence to continuous positive airway pressure (CPAP) treatment alleviates the risk of CVD in subjects with OSA. Vascular endothelial growth factor (VEGF), a potent angiogenic cytokine regulated by hypoxia-inducible factor, stimulates the progression of CVD. Thus,...
With the help of simulation tools, users can evaluate new proposals in cluster environment efficiently. However, current cloud simulators cannot meet the needs of application-driven simulation scenarios. In this paper, we propose Pallas, a task and network simulation framework that supports various cloud applications. Task-aware network scheduling and network-perceived task placement algorithms can...
Currently how to make the hearing aids more and more intelligent has attracted our interests. In order to realize adaptive amplification strategy to improve the audibility, context-aware hearing is crucial. In context-aware hearing, a big difficulty to be solved is context sensing since it is not applicable to implant multiple sensors in the limited space of hearing devices. Therefore, we propose...
The failure mechanisms of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint were investigated during EM at 150 °C under a current density of 1×104 A/cm2. In as-soldered state, (Cu,Ni)6Sn5 IMCs formed at the both Ni/solder and electroless Ni-P/solder interfaces, and the spalled (Cu0.58Ni0.42)6Sn5 was observed in the solder at the chip side. After aging for 600 h, the interfacial IMCs at the both Ni/solder...
The Cu/Sn3.0Ag0.5Cu/Ni (Cu/SAC305/Ni) solder joints were designed to investigate the Cu, Ni atoms diffusion behavior and the interfacial reaction during electromigration (EM) at 180 °C under a current density of 1.0×104 A/cm2. For comparison, the Cu/Sn3.0Ag0.5Cu/Ni solder joints were aged at 180 °C for the same durations. In as-soldered state, the (Cu0.55Ni0.45)6Sn5 and (Cu0.92Ni0.08)6Sn5 IMCs formed...
This paper proposed a novel concept of indirect under-actuation with tendon-slider mechanism. A mechanical finger with the mechanism was designed and integrated into a humanoid robotic hand-TH-2T Hand. The tendon-slider under-actuated finger proves simple but works well. In the design of the finger, the reaction force against a slider in the base segment produced by the grasped object was adopted...
Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mode, compare the performance of lead-free joints in four-point cyclic bend and accelerated temperature...
Most accelerated temperature cycling (ATC) tests reported the observations that SnAgCu (SAC) solders have better thermal fatigue reliability than SnPb solders due to their lower creep strain rate. But material studies revealed that this is true only when stress level is below a certain level. When the stress level in the solder increases, eventually the creep strain rate of SAC solder may outgrow...
A series of accelerated temperature cycling tests (ATC) and finite element analysis (FEA) were carried out to investigate the impact of double-side BGA assembly configuration on the solder joint reliability. 1.0mm&1.27mm pitch, SnAgCu and SnPb solder ball, daisy chained BGA package mounted on a 1.6mm thick PCB by SnAgCu and SnPb paste respectively, which included three configurations such as double-side...
Unlike the common types of SMT packages such as BGA and QFP, the component under investigation is a module mounted in a cavity on a PCB with their lead- fingers hanged over the edges of the cavity. This PCB assembly has a 3D configuration in nature such that regular 2D modeling is not capable to solve the problem. However, it is impractical to perform a 3D thermal fatigue analysis for this structure...
The article consists of a Powerpoint presentation on reliability of 1.0 mm pitch BGA package double-side assembly. The paper concludes that the for PCBA structure using in ATC experiments, we found: 1. for all groups, the first crack will initialize from solder joints of corner; 2. for SnAgCu alloy, double side mirror will reduce life by over 3 times compared with single-side whether by using experiment...
The article consists of a Powerpoint presentation on BGA solder joints' mechanical reliability in backside compatible soldering. The paper concludes that the solder joints' mechanical property in backside compatible soldering is as good as pure lead-free assembly; The failure location of solder joint in component shearing test is between solder pad and resin; The failure location in multi-time 4-points...
Reliability test is a very important step for any electronic products before they can be sold to the market. In the previous decades, various types of test have been developed. One of the widely used testing methods is the board bending test. A major issue of performing a reliability test is that numbers of testing samples are required since the test has to be repeated until consistent and satisfactory...
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