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High capacity, guided, millimeter wave commun ication between integrated circuits is investigated with emphasis on a glass interposer integrated architecture. Silicon rectangular waveguides with integrated internal probes are designed both from the point of view of circuit theory and antenna theory in the presence of a sub cutoff wavelength backwall taper. Simulation results are compared with vector...
Multi-core scalar CPU are approaching processing rates of 256 GFLOPS. Transport latency and bandwidth (BW) between DRAM and processor are a substantial bottleneck to optimal system performance. This is, in large part, because board level, data transport occurs over legacy L-C transmission lines having limited BW over a limited distance. Consequently, high performance, systems running memory intensive...
As high performance multi-core scalar CPU and vector GPU processors approach 256 GFLOPSof processing power, transport latency and bandwidth (BW) between on-board DRAM and processor become a substantial bottleneck to optimal system performance. This is, in large part, because board level, data transport occurs over legacy L-C transmission lines having limited BW over a limited distance. As a consequence,...
Scaling to ExaFLOPS computing, or 100 times faster than the present version of the Fujitsu K-supercomputer, presents well known challenges, among which are power dissipation, memory capacity and access bandwidth, data locality and fault tolerance. The optimum Amdahl's speed-up strategy is multi faceted, with greater memory bandwidth and lower access latency being generally recognized as areas to improve...
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