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Through Silicon Interposer (TSI) needs to fulfill multi-die stacking in one packaging which can bring high integration density, short interconnection length and small size for next generation devices. Die stacking is a key process in the TSI manufacturing flow, and within that process, die warpage is of central concern. This is because the large warpage of the Si-mterposer induces poor joining of...
Beyond 65nm node, pattern loading effect (PLE) in conventional RTP (front-side heating) has been emerged as a major yield killer. Different pattern and deposited film property strongly influence thermal absorption and emission at the integration stage of the spike anneal (e.g., STI, poly, and nitride spacers) lead to significant temperature differences across each die. Several methods for reducing...
The strain state of the superconducting Nb3Sn strands in multi-stage twisted ITER Cable-In-Conduit Conductors (CICCs) strongly determines the transport properties. For an accurate prediction of the performance and a proper understanding of the underlying phenomena, a detailed analysis of the stress and strain distribution along all individual strands is imperative. Also during the cabling process,...
This paper presents a power loss study of a machine drive system using discontinuous pulse width modulation (DPWM) excitation. Pspice modeling has been used in the inverter loss prediction, and for the machine loss analysis, finite element analysis (FEA) is employed. All the analytical research of the machine drive system power loss has been verified by calorimetric measurements. This paper provides...
This paper presents an investigation into the losses in a three-phase induction motor under different pulse width modulation (PWM) excitation conditions. The impacts of sinusoidal PWM, space vector PWM and discontinuous PWM on machine loss are compared and studied. Finite element analysis simulations are employed to predict the machine losses with the loss breakdown analysis under different PWM schemes...
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