The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A lower power and area efficient VP9 and multi-standard video decoder chip is first-reported for Android 4K TV. It supports prevalent MPEG-x, VP-x, RMx, WMV-x and H.26x series video standards in a single chip. Three high-throughput techniques, look-ahead re-mapping, early stage pipeline and dynamic-scheduled bus translation, are proposed. They cuts the processing times by 51.2% compared to the state-of-the-art...
A 4 K 2 K H.265/HEVC video codec chip supporting 14 video standard formats is implemented on a 1.491.45 mm die in a 28 nm CMOS process. Several HEVC fast algorithms reduce the coding modes by analyzing the content features leading to over 68.5% and 83% of complexity reduction in intra and inter coding, respectively. A fully parallel processing element (PE) array is adopted...
A 4K and Main-10 HEVC video decoder LSI is fabricated in a 28nm CMOS process. It adopts a block-concealed processor (BcP) to improve the visual quality and a bandwidth-suppressed processor (BsP) is newly designed to reduce 30% and 45% of external data accesses in playback and gaming scenario, respectively. It features fully core scalable (FCS) architecture which lowers the required working frequency...
A 4K×2K H.265/HEVC video codec chip is fabricated in a 28nm CMOS process with a core area of 2.16mm2. This LSI chip integrates a dual-standard (H.265 and H.264) video codec and a series of prevalent (VC-1, WMV-7/8/9, VP-6/8, AVS, RM-8/9/10, MPEG-2/4) decoders into a single chip. It contains 3,558K logic gates and 308KB of internal SRAM. Moreover, it simplifies intra/inter-rate-distortion optimization...
A first-reported 4K×2K@60fps digital TV SoC processor supporting 9 video formats and integrating HDMI/MHL receiver is fabricated in a 40nm CMOS process. It adopts error compensation processor (ECP) to improve the visual quality, and designs a memory management unit and resource sharing technique to improve the throughput and area efficiency by 38.5% and 34.3%, respectively. Moreover, a lossless compression...
A first-reported, sub-mW/fps/view multi-view video decoder chip fully compliant to 3D Blu-ray specifications is reported. It explores the resource sharing so as to integrate not only single-view MPEG-2/VC-1/AVC but multi-view MVC standards into a single die. Moreover, it features pipeline management and clock management units so as to improve the processing throughput and clock power efficiency. A...
Since the 3D coding and transmission standard is not available nowadays, we need to transfer the 3D contents through the existing coding standards. To achieve this, the most common way is to combine both left and right eye frames into one single frame, which is the so-called stereo packing. So far, there are many packing methods and each of them has different characteristics and advantages. To obtain...
In this paper, a power-aware and low power multimedia processor is presented. A novel clock gating scheme and dynamic frequency selection (DFS) are implemented to minimize the power dissipation and it integrates 7-standards (H.264 / VC1 / RV / AVS / MPEG-1 / MPEG-2 / MPEG-4) with several resource-sharing techniques in both algorithmic and architectural levels so as to achieve significant area and...
A fully-compliant high-definition video decoder LSI for Blu-ray Disc (BD) player is presented. It supports MPEC-2 MP@HL, H.264 HP@L4.1, and VC-1 AP@L3 video decoding in a single chip and features resource sharing and memory management unit to achieve area/throughput efficiency. A test chip is fabricated and integrates 515 K logic gates with 522 Kbits of embedded SRAM in 90nm single-poly seven-metal...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.