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SRAM is a major component in semiconductor industry which often requires extensive and exhaustive method of fault isolation, especially for a non-visual defect in a soft failure mode. For these cases, nanoprobing on CA layer is often performed but there are times when it fails to isolate any defect. One reason may be because the failure only occurs at high temperature test environment. This paper...
As the development of semiconductor process, more and more advanced technologies were applied in the IC manufacturing. The device becomes more precise, and more sensitive to the minor process variation. Failure analysis challenge comes along with these advanced processes. Lithography process is one of the most critical semiconductor processes. The issue with this process has its own property. Based...
As the semiconductor technology keeps scaling down, Poly silicon gate pattern becomes more and more critical. If the Poly silicon variation is too big or some mismatch, it will induce severe logic parametric fail or even functional fail, whi ch is difficult for the failure analysis. For the analog device, it ca n induce functional fail. In this case, a function related failure was analyzed an d the...
Conventionally, Static Random Access Memory (SRAM) failures rely on memory bitmap for failure analysis. Static fault localization approach is ineffective except if the defect is large enough to cause a resistive short between the VDD and VSS nodes. However, it was observed that subtle defects that fall in the wordline (WL) of the pass gate transistor results in a partially turned-on NMOS with electroluminescence...
This paper describes the effectiveness of using light induced Current Imaging — Atomic Force Microscopy (CI-AFP) to localize defects that are not easily detected through conventional CI-AFP. Defect localization enhancement for both memory and logic failures has been demonstrated. For advanced technology nodes memory failures, current imaging from photovoltaic effects enhanced the detection of bridging...
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