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Failure Analysis (FA) consists of fault verification, isolation, defect tracing, characterization and physical (elemental) analysis. It helps wafer fab to understand the root causes of low yield cases, drive the yield improvement activities. Due to the complexity of modern Integrated Circuits (ICs), defects causing the failure need more effort, a variety of FA tools to be identified. In this case,...
As semiconductor technology advance, NVM memory structure find more and more application in the IC product. Majority part of NVM is charge-based where charge can be injected into or removed from a critical region of a device. This storage cell is normally floating and cannot be accessed directly. So the analysis on this floating structure is quite challenge, especially on the specific cell of the...
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