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Light Emitting Diodes (LEDs) as an emerging light source has been rapidly developed due to its considerable advantages including high energy efficiency, extremely long life and environmentally friendly. Since packaging accounts for the major part of the total cost, a novel molding process for wafer level LED packaging will be presented in this paper, which could decrease the total cost by the wafer...
After the first white light-emitting diodes (WLEDs) became commercially available, much attention has been paid to the development of WLEDs because of their extensive applications in solid lighting. Compared with traditional lighting, WLEDs have more advantages, such as high efficiency, long lifetime, fast response and environmental-friendliness [1-3]. It has been widely used in signals, displays...
WLCSP (wafer level chip scale package) has been well accepted within modern industry which brings not only the reduction of package size, but also good thermal performance vs. more traditional peripherally leaded packages. At the mean time, WLCSP feathers can significantly lower manufacturing costs. One of the barriers for WLCSP package to be accepted in the industry is the lack of existing and mature...
In this paper, an improved chemical foaming process (CFP) for wafer-level glass cavities will be demonstrated for volume production in a clean room. First of all, suitable foaming agents transferring techniques are investigated to avoid powder pollution to the chips in a clean room. In addition, the precise controlling of the sizes of the glass cavities is studied theoretically and experimentally...
The styrene (St) and isobornyl methacrylate (IBMA) random copolymer beads with controlled glass transition temperature (Tg), in the range of 105–158°C, were successfully prepared by suspension polymerization. The influence of the ratios of IBMA in monomer feeds on the copolymerization yields, the molecular weights and molecular weight distributions of the produced copolymers, the copolymer compositions...
On chip integrated inductors and transformers require novel and improved materials and CMOS-compatible Wafer Level Magnetics (WLM) deposition techniques. In this work we are presenting an Fe-Co based amorphous magnetic alloy, called FCA that was specifically designed and developed by Enpirion to be used for the first time in volume production for highly integrated and miniaturized power management...
LED (light-emitting diode) has many advantages over traditional lighting source such as higher electrical efficiency, faster response, and free of hazardous, which has been attracting more and more interesting from all of world. LED technology has achieved remarkable progress during latest years already. However, high price is still the main block for its wide application.
In order to achieve high precision and stability in the measurement and weigh system of packing industry, base on traditional PID algorithm, this paper takes the fuzzy control theory into the controller, adopts this fuzzy-PID controller to the complex process with non-linear and strong interferes in packing and automatically switches between fuzzy algorithm and PID algorithm according to the error...
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