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This paper presents innovations and advances in demonstrating paper-thin organic packages with low warpage. These advances include: 1) Reduction in over-all substrate warpage, 2) Ultra-low stand off interconnection height, 3) Ultra-thin (30 μm core thickness) and ultra-low CTE (1–5 ppm/°C) organic substrates, 4) Assembly of large die onto the ultra-thin substrate, and 5) Assembly to form advanced...
This paper presents the design, analysis, and demonstration of an ultra-thin wireless local area network (WLAN) RF receiver module with chip-last embedded actives and embedded passives in a low-loss organic substrate using system-on-package approach. The overall thickness of the module, including the embedded dies, is \(160~\mu \) m- more than \(3\times \) thickness reduction compared to current...
Package-on-package (PoP) technologies used in smart phones and tablets are reaching limits in logic-to-memory bandwidth and in thickness reduction. Advances in PoP including through-mold vias (TMVs) and low-CTE, high-modulus laminate substrates have not been able to overcome the I/O density and thickness limitations to date. To overcome these barriers, two major technologies have been pursued. The...
The degree-of-cure of an anisotropic conductive film (ACF) was theoretically predicted and experimentally measured to investigate the effect of the degree-of-cure of the ACF on the electrical and mechanical stability of ACF joints and the reliability of COF assemblies. The cure reaction of the ACF observed by isothermal DSC analysis followed an autocatalytic cure mechanism, and the degree-of-cure...
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