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The mechanism of resonant frequency shift of MEMS gyroscope subjected to environment temperature change was investigated comprehensively in this paper, and its computational model was set up based on certain assumptions. Taking the structure of MEMS gyroscope as an example using the finite element method, firstly, the authors derived the simplified M-C-K dynamic model. Then, thermal stress and the...
Reliability problems heavily hinder light-emitting diode (LED), especially high brightness LED, from developing rapidly and putting into mass production. One of the most important reasons is that it has so many interfaces which are always the weakest places. LED chip's working temperature is about 90°C and the high mismatch of coefficient of expansion of different materials can inevitably cause failures,...
A Product-Level Reliability Estimator (PLRE), which calculates failure rate of a chip as a function of use conditions, has been developed for the first time. Major wafer-level failure mechanisms such as Time-Dependent Dielectric Breakdown (TDDB) and Electro Migration (EM) are included. By applying PLRE to the product with advanced CMOS technology, contributions from each block and each failure mechanism...
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