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A newly developed copper foil which is chemically processed has been introduced as nano anchoring copper foil for Printed Wiring Board (PWB). This treatment technology enables good adhesion even on the nano-scale surface roughness by conditioning a copper surface of nano-scale anchoring structure. The surface roughness of the copper foil affects fine patterning capability and transmission loss. Fine...
Transmission light property due to surface plasmon resonance (SPR) was investigated for glass substrate/500-nm-thick fluoropolymer (CYTOP) with a grating structure/thin metal film/mixed solution of water and glycerol system. Transmission light peaks were observed due to grating-coupled SPR, with a remarkable peak intensity when pure water exists as an ambient dielectric. CYTOP exhibits a refractive...
Buildup PWB (Printed Wiring Boards) for semiconductor package is widely used which is laminated the buildup materials onto the core materials (high Tg FR4, FR5 or BT). Generally, epoxy based buildup materials is used without glass cloth for the package of ASIC's(Application Specific Integrated Circuits), CPU's, GPU's, and other IC's that require large numbers of I/O(input/output) circuits because...
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