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We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices above standard CMOS. The packages, having cavities as large as 1 mm2, make use of pillars designed to withstand subsequent molding during 1st level packaging. Covers on top of the release holes avoid deposition inside the cavity during sealing....
Quiescent supply current (IDDQ) is a very effective test method for CMOS circuits. However, IDDQ vector verification and debugging may take considerable time and effort; various problems have been encountered in this process, so different tools and methodologies have been devised to address them. For pre-silicon IDDQ vector verification, a modular approach is adopted. IDDQ is estimated for each vector...
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