The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We adopted the GaAs-PHEMT 3-D Wafer Level Chip Size Package (3-D WLCSP) technology to a prototype 76–81 GHz street surveillance radar MMIC's. A transmitter (Tx) MMIC is a compact harmonic up-mixer MMIC with an integrated local chain, followed by a power amplifier (PA) MMIC. A receiver MMIC integrates a pair of receivers each of which contains a compact image-rejection harmonic mixer, low noise amplifier,...
A 79-GHz band miniature mixer fabricated by using our 3-D WLCSP technology and PHEMT is demonstrated. The mixer consists of a balanced harmonic mixer pair to enhance LO-to-RF leakage suppression. The balun for out-of-phase power splitting is a half-sized Marchand balun, effectively miniaturizing the mixer unit. The 40-GHz and 80-GHz band baluns were designed in the same fashion. Though their bandwidth...
A set of E-band power amplifiers (PAs) which support the 71–76 GHz- and 81–86 GHz-bands with a gain of 25 dB and P1dB of greater than 25 dBm is presented. The final stage of each PA MMIC combines four unit amplifiers in parallel. The saturation output power level is between 25 dBm and 30 dBm. The maximum saturation output power level is achieved at the 71 GHz. The unit amplifier for each band is a...
Cost effective E-band Low Noise Amplifier (LNA) using a three-dimensional (3-D) MMIC technology and wafer level chip size package (WLCSP) technology is presented. The reflow-soldering compatibility of the technology makes MMIC assembly on PCB very simple and significantly contributes to mass production of receivers and transmitters. The applied 3-D MMIC design effectively shrinks the die sizes. The...
Newly developed E-band receiver (RX) and transmitter (TX) modules are demonstrated. The reflow-soldering compatibility of the 3-D WLCSP MMIC is made to assemble easily on PCB, which contributes to high mass productivity. The RX module is the first edition, and the TX module is the second edition with an improved Power Amplifier (PA). The PA is designed separately for lower and higher bands; 71 to...
Newly developed E-band receiver (RX) and transmitter (TX) modules are demonstrated. The reflow-soldering compatibility of the 3-D WLCSP MMIC is made to assemble easily on PCB, which contributes to high mass productivity. The RX module is the first edition, and the TX module is the second edition with an improved Power Amplifier (PA). The PA is designed separately for lower and higher bands; 71 to...
The first edition of E-band transmitter module is demonstrated. This module is consisted of four WLCSP MMICs solder-reflowed on a designated PCB 14 mm × 10 mm in size. Because the WLCSP technology is incorporated, the module is mass producible and potentially very low cost compared with the current E-band products. The treatment of WLCSP MMIC in the E-band should be carefully done so as to suppress...
Cost effective E-band transmitter and receiver chipset MMIC's, that use a three-dimensional MMIC technology optimized for flip-chip implementation, are under development. Here, the first edition of MMIC's successfully designed and fabricated are presented. The MMIC structure incorporates inverse TFMS lines so that a ground metal can be applied to cover the whole chip surface except for interconnect...
Cost effective 77GHz transmitter and receiver MMIC's, that use a three-dimensional MMIC technology optimized for flip-chip implementation, are presented. The MMIC structure incorporates inverse TFMS lines so that a ground metal can be applied to cover the whole chip surface except for interconnect pads. Four metal layers including the ground metal are formed between and the top surface of polyimide...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.