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Traditional power delivery network (PDN) is made up of passive element such as resistor, capacitor and inductor which are provided by chip, package and PCB network. Those equivalent circuit models could be generated by commercial EDA tools. If the PDN is dynamic, however, there is no tool to simulate and model such network. In this paper, we propose a methodology to simulate dynamic PDN in time and...
DDR3 memory interface (I/F) with single-end signals is very sensitive to external environments, such as chip package type and system board design. In order to guarantee the system performance, IP providers often define the package and PCB design constraints to reduce product risks [1]. These design constraints may increase the package size and DDR3 PCB area to cost, increasing the whole system cost...
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