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Intel® 4th generation Core™ microprocessors are powered by high frequency integrated switching voltage regulators. The inductors required to implement these regulators were constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the simulation and measurement of these embedded inductors including representative results from production packages.
Embedded passives technology has been of interest to electronic package designers for performance improvement and package size reduction. With the explosion of mobile phones, tablets and other hand held devices, the need for smaller form factor products with equivalent or better electrical performance makes a very compelling case for embedding passives. The benefits of embedded passives are not limited...
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