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Package-on-package (PoP) assemblies may experience warpage during package fabrication and later during surface mount assembly. Excessive warpage may result in loss of coplanarity, open connections, misshaped joints, and reduction in package board-level reliability under environmental stresses of thermal cycling, shock, and vibration. Previous researchers have shown that warpage may be influenced by...
Package-on-Package (PoP) assemblies may experience warpage during package fabrication and later during surface mount assembly. Excessive warpage may result in loss-of-coplanarity, open connections, mis-shaped joints, and reduction in package board-level reliability (BLR) under environmental stresses of thermal cycling, shock and vibration. Previous researchers have shown that warpage may be influenced...
The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board laminates such as FR4 are composites of epoxy resin with woven fiberglass reinforcement. Interaction between manufacturing process variables that impact the changes in glass transition...
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