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Package-on-package (PoP) assemblies may experience warpage during package fabrication and later during surface mount assembly. Excessive warpage may result in loss of coplanarity, open connections, misshaped joints, and reduction in package board-level reliability under environmental stresses of thermal cycling, shock, and vibration. Previous researchers have shown that warpage may be influenced by...
Package-on-Package (PoP) assemblies may experience warpage during package fabrication and later during surface mount assembly. Excessive warpage may result in loss-of-coplanarity, open connections, mis-shaped joints, and reduction in package board-level reliability (BLR) under environmental stresses of thermal cycling, shock and vibration. Previous researchers have shown that warpage may be influenced...
Electronics in aerospace applications may be subjected to very high g-levels during normal operation. A column array interconnect has been studied for reliability during extended duration aerospace missions in presence of high-g levels. Ceramic area-array components have been populated with column interconnects. The wire column interconnects are fabricated using a two piece fixture that holds a ceramic...
Electronics in aerospace applications may be subjected to very high g-loads during normal operation. A novel micro-coil array interconnect has been studied for increased reliability during extended duration aerospace missions in presence of high-g loads. Ceramic area-array components have been populated with micro-coil interconnects. The micro-coil spring (MCS) is fabricated using a beryllium copper...
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