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This paper reports a novel thin film based flexible clamp-on type current sensor with 250 turns micropatterned Cu coil (line / space = 50 μm / 105 μm) formed by through-holes and flexible printed circuits (FPC) technologies for wireless sensor networks. Using flexible electronics techniques, microvias and fine stripe Cu patterns could be formed around 60-mm-long and 14.5-mm-wide permalloy film sandwiched...
A passive (power-less), bending type MEMS DC current sensor to satisfy the increasing needs of DC power supply for monitoring the electricity consumption by either one-wire or two-wire appliance cord was proposed in our past work (DTIP 2011). A MEMS-scale prototype DC sensor, comprised of 5 parallel PZT plates, was then micro-fabricated for preliminarily examination (DTIP 2012). A novel oscillating...
In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using a chip mounter with a vacuum collet. Using these methods, one can mount not only ultra-thin microsensors but also microcontroller and amplifier chips required for sensor device fabrication. We successfully transfer-printed a very fragile microelectromechanical systems-based 5-mm-long,...
In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using adhesive rubber stamps mounted on a chip mounter. By using these methods, not only ultrathin microsensors but also microcontroller and amplifier chips required for the fabrication of sensor devices can be mounted. We successfully transfer-printed a very fragile 5-mm-long, 1-mm-wide, 5μm-thick...
We proposed a thin piezoelectric cantilever to measure an airflow velocity change. An airflow sensor using a PZT cantilever and a flow channel was fabricated. We measured the relationship between the airflow velocity change and the piezoelectric voltage of the cantilever. The dimensions of the sensor and the cantilever are 25 mm × 20 mm × 20 mm and 1500 μm × 1000 μm × 2 μm respectively. We evaluated...
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